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Workshop "Microassembly: Robotics and Beyond"

A workshop with IEEE International Conference on Robotics and Automation, ICRA 2013, May 10th, 2013, Karlsruhe, Germany

Introduction

This workshop addresses the current trend and challenges in microassembly, where robotics and automation are among the most important enabling technologies. Microassembly is an important enabling technology for microsystem assembly and packaging, especially with the current trend on heterogeneous micro- and nanosystems in 3D integration and large area and flexible electronics. Such heterogeneous integration also brings new challenges to microassembly, because those components are of different nature, e.g. mechanical, electromechanical, optical, fluidic, and can also be in different scales from millimeters to micrometers or even smaller. Moreover, the demands on simultaneous high-precision and high-throughput, or high-throughput on high spatial distribution, as well as the ever diminishing component size, can go well-beyond what can be offered by the current industrial robots and brings great challenges to microassembly research. On the other hand, technologies from other sectors, e.g. self-assembly, laser transfer, parallel transfer, transfer printing, has gain significant progress. Therefore, the microassembly technology should be discussed with a wider scope that what it has been.

The objective of the workshop is to bring the researchers from not only robotics and automation sector, but also from other technological sector as well as the application field to discuss this very important and actively evolving topic. The aim is to have a more balanced and objective understanding of the technological trends as well as the real-world demands, and to align the future research of microassembly in the robotics and automation field.

The topics to be addressed in the workshop include but not limited to: robotic microassembly, self-assembly, bio-assisted microassembly, laser-induced die transfer, thin-die handling, hybrid microassembly, micro-nano integration, 3D integration, MEMS integration, optical microsystems, flexible electronics packaging.

Speakers

Karl F. Böhringer (Invited), University of Washington, Seattle, WA, USA
Karl F. Böhringer received his Dipl.-Inform. degree from the University of Karlsruhe, Germany in 1990 and his M.S. / Ph.D. degrees in computer science from Cornell University, Ithaca, NY in 1993 / 1997. He was a Visiting Scholar at Stanford University in 1994-5 and a Postdoctoral Researcher at the University of California, Berkeley from 1996 to 1998. He joined the University of Washington in Seattle, WA in 1998, where he is Professor of Electrical Engineering and Bioengineering and currently holds the John M. Fluke Distinguished Chair of Engineering. He is Director of the Microfabrication Facility and of the National Nanotechnology Infrastructure Network site at the University of Washington. He held visiting faculty positions at the Universities of Tohoku, Tokyo, Kyoto (Japan), and São Paulo (Brazil). His research interests include microelectromechanical systems (MEMS), manipulation and assembly from macro to nano scales, microfluidic systems for the life sciences, and microrobotics. He has created, among others, multi-batch selfassembling systems, massively parallel microactuator arrays, and a walking microrobot. Dr. Böhringer is a fellow of IEEE and he is member of the Society for Nanoscale Science, Computing and Engineering (ISNSCE), the American Society for Engineering Education (ASEE), and the German Society for Information Sciences (GI). He was awarded a Long-term Invitational Fellowship for Research in Japan by the Japan Society for the Promotion of Science (JSPS) in 2004, an IEEE Robotics & Automation Society Academic Early Career Award in 2004, an NSF CAREER Award in 1999, and an NSF Postdoctoral Associateship in 1997. His work was listed among the “Top 100 Science Stories of 2002” in Discover magazine. He is an editor of the ASME/IEEE Journal of Microelectromechanical Systems and the IEEE Transactions on Automation Science and Engineering. He has served, among others, on the technical program committees for the IEEE MEMS and Transducers conferences and he was general co-chair of IEEE MEMS in 2011.
Michael Gauthier, Femto-ST, Besancon, France
 Δ Prof. Michael Gauthier is currently the head of the Automation and Micromechatronics (AS2M) research department which includes 70 scientists working in micro-nanomechatronics (3 teams) and Prognostics (PHM) based on artificial intelligence (1 team). He is also the head of the French national micro-nanorobotics cluster in “Excellence Robotics – ROBOTEX” network. He has a strong background in micro-nanorobotics and has been recently granted by the “French CNRS bronze medal” (Early Career Award for 5% top scientist) and has reached the grade of CNRS research director (directeur de recherche CNRS) in 2012, grade equivalent to full professor. He is author of one book, four book chapters, one patent, 28 journal articles and 42 communications in international conferences.
Kimmo Keränen (invited), VTT, Oulu, Finland
Sylvain Martel (invited), Ecole Polytechnique of Montreal, Canada
 Δ Sylvain Martel received the Ph.D. degree in Electrical Engineering from McGill University, Institute of Biomedical Engineering, Montréal, Canada, in 1997. Following postdoctoral studies at the Massachusetts Institute of Technology (MIT), he was appointed Research Scientist at the BioInstrumentation Laboratory, Department of Mechanical Engineering at MIT. From Feb. 2001 to Sept. 2004, he had dual appointments at MIT and as Assistant Professor in the Department of Electrical and Computer Engineering, and the Institute of Biomedical Engineering at École Polytechnique de Montréal (EPM), Campus of the University of Montréal, Montréal, Canada. He is currently Professor in the Department of Computer and Software Engineering, and the Institute of Biomedical Engineering, and Director of the NanoRobotics Laboratory at EPM that he founded in 2002. Dr. Martel is a Fellow of the Canadian Academy of Engineering and held the Canada Research Chair (CRC) in Micro/Nanosystem Development, Fabrication and Validation from 2001 to 2010 prior to obtain the Research Chair of École Polytechnique. In the medical field alone, he pioneered several innovative technologies such as the first parallel computing platform for remote surgeries, direct cardiac mapping systems designed to investigate the cause of sudden cardiac deaths, and new brain implants for decoding neuronal activities in the motor cortex. Presently, Dr. Martel is leading an interdisciplinary team involved in the development of new types of therapeutic agents and interventional platforms for cancer therapy.
G.R.B.E. Römer (invited), University of Twente, Netherland
 Δ Dr. Ir. G.R.B.E. Römer Master, cum laude in Electrical Engineering, Ph.D. Mechanical Engineering, is an Associate Professor of the laser technology group at Twente University. He has over 15 years experience in executing as well as managing national and international R&D laser projects for a large number of public bodies and companies. In addition, as manager R&D of a company developing advanced robotics, for several years, he has a broad experience in knowledge transfer and management of R&D projects in the private sector. Further, his scientific focus and excellence is on the development of process-sensors, the modelling and real-time control of laser-material processes (to ensure reliable processing results), as well as robotics and mechatronics.
Philippe Soussan (invited), IMEC, Leuven, Belgirum
Philippe Soussan is graduated in material science and material mechanicals from ENSAM (Paris, France) and ENSMP (Paris, France) in 1999 and 2000, respectively. His field of expertise covers the interaction between processes and material properties, as well as technology integration for advanced interconnects in wafer level packaging, 3D integration and microsystems.

He started his career at IMEC as a researcher in the field of integrated passive devices and wafer level packaging, From 2007 till 2011, he has led the group “Packaging, Microsystems and Hybrid Technology”. The group dealt with complex process integration using 3D interconnects, advanced packaging and micro fabrication of scaling and non-scaling driven components. He has authored or coauthored more than 100 publications and own several patents in this field. Since 2011, he became program manager for the smart system division of IMEC, which mission is to enable novel product in the field of More than Moore, such as detector, life sciences instruments and specialty components. Within his function, he is in charge of technology R&D and low volume manufacturing. Such products are typically multi-physics and require novel approaches in order to be integrated as System on Chip or System in a Package...

Quan Zhou, Aalto University, Espoo, Finland
 Δ Quan Zhou received the M.Sc degree in Control Engineering and Dr. Tech. degree in Automation Technology, both from Tampere University of Technology, Tampere, Finland. He is an adjunct professor at the Department of Automation and Systems Technology, School of Electrical Engineering, Aalto University, Finland. Since 2000, he has been actively leading research teams in microrobotics and microassembly in three different universities. He was a professor at the School of Mechatronics, Northwest Polytechnical University, Xi’An, China from 2005. Since 2008, he returned to Aalto University leading the Micro- and Nanorobotics research group. The current goal of his research is to bring microrobotics and self-assembly together, including hybrid assembly, robotic assembly, and self-assembly, and their applications in RFID assembly, handling of optoelectronic components, and 3D integration of microsystems. He is also actively working on mobile microrobots and micro- and nanomechatronic systems, and their industry and biomedical applications. Currently he is leading the EU FP7 project FAB2ASM as the coordinator.

Schedule

8:30 Opening of the workshop pdf
8:35 - 9:10 Philippe Soussan,

3D Heterogeneous Integration: The convergence between wafer bonding and die stacking pdf

9:10 - 9:45 Karl F. Böhringer

Scaling towards massively parallel micro-self-assembly pdf

9:45 - 10:25 Poster Session + Coffee Break
10:25 - 11:00 Kimmo Keränen,

Roll-to-roll rotary screen printing and LED chip bonding on polymer substrates pdf

11:00 - 11:35 G.R.B.E. Römer,

Laser induced die transferring and patterning pdf

11:35 - 12:10 Sylvain Martel,

Controlled Microassembly and Transport of Nano- and Micro-components Using Bacteria pdf

12:10 - 12:50 Quan Zhou, Michaël Gauthier,

Fusion of robotic microassembly and self-assembly for microsystem integration and thin-chip microassembly for 3D integration (PART 1 pdf, PART 2 pdf)